ITX / SFF
Items 1 - 10 of 14
Very compact aluminium heat sink from Silverstone with active fan. Suitable for 19-inch systems and servers with 1U (height units) as well as other confined environments. The heat sink is mounted by screwing it into two enclosed self-adhesive base plates with threads, which need to be attached underneath the mainboard. Suitable for intel processors with socket LGA1700 (‘Alder Lake/Raptor Lake’ / 12th/13th/14th gen) and a max. TDP of up to 95 watts.
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). The mounting is done via "push-pin" mounting with plastic pins - without screwing a base plate underneath the mainboard (as is the case with the alternative model Dynatron Q3). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Compact aluminum heatsink with active fan for 19 inch systems and servers from 2U (height units) or small form factor systems (SFF). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 65 watts.
Compact copper/aluminum heatsink with integrated heatpipes and active fan for 19 inch systems and servers from 2U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Compact aluminum heatsink with quiet running active fan for compact ITX systems or servers from 2U. The mounting is accomplished via "Push-Pin" fastening with plastic pins - without screwing a base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S and Raptor Lake" / 12th/13th gen.) and a max. TDP of up to 125 Watt.
Tower heatsink from copper and aluminum with active fan for 19 inch systems and servers from 3U (height units) and up. The mounting is accomplished with screws that connect to the included metal base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Very compact active cooler with aluminium heatsink for intel processors with socket LGA 1150/1151/1155/1156/1200 and a maximum TDP of up to 85W. The cooler is suitable for compact mini ITX systems or flat 19-inch cases with 2U (or higher).
Very flat aluminum heatsink with silent active 80mm fan for 19-inch rack-mount server-systems with a height of 1U/2U or other very compact computer-systems. Supports intel processors with socket 1150, 1155, 1156 and 1200 (i.e. Core i3, i5, i7 etc.) and a TDP of up to 65 watts. High-grade and robust industrial quality from Dynatron.
Sehr flacher passiver CPU Kühlkörper aus Aluminium für 1HE Server. Geeignet für Sockel 1150, 1151, 1155 und 1156 (z.B. Core i3, i5, i7, XEON 3400 Series etc.).
Items 1 - 10 of 14