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Items 1 - 7 of 7
LGA1700
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
LGA1700
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). The mounting is done via "push-pin" mounting with plastic pins - without screwing a base plate underneath the mainboard (as is the case with the alternative model Dynatron Q3). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Very powerful and extremely compact cooler for AMD EPYC processors with SP3 socket. The cooler fits into 19-inch cases from 1U or larger and cools processors with a maximum TDP of up to 225 Watts.
Very flat aluminum heatsink with silent active 80mm fan for 19-inch rack-mount server-systems with a height of 1U/2U or other very compact computer-systems. Supports intel processors with socket 1150, 1155, 1156 and 1200 (i.e. Core i3, i5, i7 etc.) and a TDP of up to 65 watts. High-grade and robust industrial quality from Dynatron.
Very flat aluminum heatsink with silent active radial-fan for 19-inch rack-mount server-systems with a height of 1U or other very compact computer-systems. Supports intel processors with socket 1150, 1155, 1156 and 1200 (i.e. Core i3, i5, i7 etc.) and a TDP of up to 55 watts. High-grade and robust industrial quality from Dynatron.
Very powerful and extremely compact cooler for intel processors with socket FCLGA 3647 in narrow ILM format. The cooler fits into 19-inch enclosures with 1U or larger and cools processors with a maximum TDP of up to 165 watts - but works quite loudly.
Very powerful and extremely compact cooler for intel processors with socket LGA2011/LGA2066 in narrow format. The cooler fits into 19-inch enclosures with 1U or larger and cools processors with a maximum TDP of up to 160 watts - but works quite loudly.
Items 1 - 7 of 7