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High quality extended-ATX server tower chassis from Chenbro for professional applications. Basic chassis without power-supply or backplane. The case is suitable for operation with large server-mainboards (up to 12" x 13" / E-ATX), but can also be used with smaller standard mainboards (mini ITX, micro ATX, standard ATX).
This extremely compact and flat SATA cable complies with the latest standards and has a data transfer rate of up to 6 Gb/s. Due to its slim design and high flexibility, we recommend this cable especially for installation in very compact servers and mini ITX enclosures. The cable is our internal reference class and is used often while building our complete server-systems.
This extremely compact and flat SATA cable complies with the latest standards and has a data transfer rate of up to 6 Gb/s. Due to its slim design and high flexibility, we recommend this cable especially for installation in very compact servers and mini ITX enclosures. The cable is our internal reference class and is used often while building our complete server-systems.
Dual Mini Backplane for the installation of two 2.5 inch SAS/SATA hard disks or SSDs in an internal 3.5 inch drive bay. The backplane is ideally suited for setting up a RAID-1 array in a small PC case (e.g. HTPC, Miniserver). The frame is completely made of robust metal and can accommodate HDDs and SSDs up to a maximum height of 9.5mm each.
LGA1700
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
LGA1700
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). The mounting is done via "push-pin" mounting with plastic pins - without screwing a base plate underneath the mainboard (as is the case with the alternative model Dynatron Q3). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
LGA1700
Compact aluminum heatsink with active fan for 19 inch systems and servers from 2U (height units) or small form factor systems (SFF). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 65 watts.
LGA1700
Compact copper/aluminum heatsink with integrated heatpipes and active fan for 19 inch systems and servers from 2U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
With the RM14300, Chenbro offers a high quality 19" enclosure with a depth of only 41cm and 1U, which is suitable for use with mini ITX and micro ATX mainboards. The enclosure can also be installed rotated by 180 degrees so that the rear ports of the mainboard are accessible from the front.
LGA1700
Compact aluminum heatsink with quiet running active fan for compact ITX systems or servers from 2U. The mounting is accomplished via "Push-Pin" fastening with plastic pins - without screwing a base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S and Raptor Lake" / 12th/13th gen.) and a max. TDP of up to 125 Watt.
Items 1 - 10 of 22