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High-quality 60mm case fan from Silverstone with PWM for use in server or industrial applications. This is a very good and powerful 60mm fan, which we also install in some of the complete systems we manufacture. The hydrodynamic bearing (HDB) of this fan also ensures a long service life. The 35cm long connection cable is directly connected to a short socket on the fan. Alternatively, with an included speed reduction cable, the fan can be operated in silent mode at only max. 2,850upm.
Professional 80mm chassis turbofan from Silverstone with PWM for server or industrial use. This is one of the most powerful 80mm fans we could find on the market. The dual ball bearing of this fan also ensures a long service life. Please note the special installation depth of 38mm.
High quality extended-ATX server tower chassis from Chenbro for professional applications. Basic chassis without power-supply or backplane. The case is suitable for operation with large server-mainboards (up to 12" x 13" / E-ATX), but can also be used with smaller standard mainboards (mini ITX, micro ATX, standard ATX).
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LGA1700
Very compact aluminium heat sink from Silverstone with active fan. Suitable for 19-inch systems and servers with 1U (height units) as well as other confined environments. The heat sink is mounted by screwing it into two enclosed self-adhesive base plates with threads, which need to be attached underneath the mainboard. Suitable for intel processors with socket LGA1700 (‘Alder Lake/Raptor Lake’ / 12th/13th/14th gen) and a max. TDP of up to 95 watts.
Dual Mini Backplane for the installation of two 2.5 inch SAS/SATA hard disks or SSDs in an internal 3.5 inch drive bay. The backplane is ideally suited for setting up a RAID-1 array in a small PC case (e.g. HTPC, Miniserver). The frame is completely made of robust metal and can accommodate HDDs and SSDs up to a maximum height of 9.5mm each.
LGA1700
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
LGA1700
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). The mounting is done via "push-pin" mounting with plastic pins - without screwing a base plate underneath the mainboard (as is the case with the alternative model Dynatron Q3). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
LGA1700
Compact aluminum heatsink with active fan for 19 inch systems and servers from 2U (height units) or small form factor systems (SFF). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 65 watts.
LGA1700
Compact copper/aluminum heatsink with integrated heatpipes and active fan for 19 inch systems and servers from 2U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
With the RM14300, Chenbro offers a high quality 19" enclosure with a depth of only 41cm and 1U, which is suitable for use with mini ITX and micro ATX mainboards. The enclosure can also be installed rotated by 180 degrees so that the rear ports of the mainboard are accessible from the front.
Items 1 - 10 of 25