German
CPU Coolers intel
Items 1 - 10 of 13
Very flat copper-heatsink with active radial-fan for 1U server-systems. Compatible with socket 1150, 1151, 1155, 1156 and 1200 (i.e. Core i3, i5, i7, XEON 3400 series etc.)
Very compact active cooler with aluminium heatsink for intel processors with socket LGA 1150/1151/1155/1156/1200 and a maximum TDP of up to 85W. The cooler is suitable for compact mini ITX systems or flat 19-inch cases with 2U (or higher).
Very powerful and extremely compact cooler for intel processors with socket FCLGA 3647 in narrow ILM format. The cooler fits into 19-inch enclosures with 1U or larger and cools processors with a maximum TDP of up to 165 watts - but works quite loudly.
Sehr flacher passiver CPU Kühlkörper aus Aluminium für 1HE Server. Geeignet für Sockel 1150, 1151, 1155 und 1156 (z.B. Core i3, i5, i7, XEON 3400 Series etc.).
Very flat copper-heatsink with active radial-fan for 1U server-systems. Compatible with socket 1150, 1151, 1155, 1156 and 1200 (i.e. Core i3, i5, i7, XEON 3400 series etc.).
Very flat aluminum heatsink with silent active radial-fan for 19-inch rack-mount server-systems with a height of 1U or other very compact computer-systems. Supports intel processors with socket 1150, 1155, 1156 and 1200 (i.e. Core i3, i5, i7 etc.) and a TDP of up to 55 watts. High-grade and robust industrial quality from Dynatron.
Compact aluminum heatsink with active fan for 19-inch rack-mount server-systems with a height of 2U+ or other very compact computer-systems. Supports intel processors with socket 1150, 1155, 1156 and 1200 (i.e. Core i3, i5, i7 etc.) and a TDP of up to 125 watts. High-grade and robust industrial quality from Dynatron.
LGA1700
Compact aluminum heatsink with quiet running active fan for compact ITX systems or servers from 2U. The mounting is accomplished via "Push-Pin" fastening with plastic pins - without screwing a base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S and Raptor Lake" / 12th/13th gen.) and a max. TDP of up to 125 Watt.
LGA1700
Compact copper heatsink with active fan for 19 inch systems and servers with 1U (height units). Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
LGA1700
Tower heatsink from copper and aluminum with active fan for 19 inch systems and servers from 3U (height units) and up. The mounting is accomplished with screws that connect to the included metal base plate underneath the mainboard. Suitable for intel processors with socket LGA1700 ("Alder-Lake S" / 12th gen.) and a max. TDP of up to 125 watts.
Items 1 - 10 of 13